Architecture Exploration for Die-to-Die Communications

Anshul Rao () and Pinelopi Georgiou ()

Description

As Moore’s law is expected to reach physical limitations and plateau, engineers are looking for new ways to extend it. The introduction of chiplet technology is set to revolutionize the market by continuing this increase in performance; rather than designing an entire system on the same die, designers are looking to divide the tasks and functions. This novel approach enables systems to have heterogeneous parts, which can be reusable, independently customizable, and more importantly, have different origins. A new method is then needed to bridge pre-existing systems and protocols to emerging die-to-die interconnects.