Approved
Signal Integrity Analysis of Package and PCB for High Speed Data Link Application
Sreejith Palleeluveedu Raghavan (2010)
Start
2011-07-04
Presentation
2012-01-18
Location:
Finished:
2012-01-18
Master's thesis:
Abstract
Supervisor: Kalpesh Shah (TI India)
Examiner: Peter Nilsson (EIT)