EIT, Project, Low signature, Project facts, 2006-01-01 -> 2009-06-30

Abstract:	This project concerns the electromagnetic integration of sensors on an aircraft. It is aimed at designing and manufacturing a technology demonstrator for reduced signature. It involves several participants from Swedish industry (Saab Microwave Systems, Applied Composites AB, Saab Aerosystems, Saab Bofors Dynamics, FOI) and universities (Lund University and Royal Institute of Technology).
Project leader(s):	Daniel Sjöberg
Participants:	Mats Gustafsson
Funding:	Swedish Agency for Innovation Systems (VINNOVA), NFFP4 Swedish Defence Material Administration (FMV)

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